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alcatel Go Flip 3

Available
alcatelMobiles
Spec score
100%

The alcatel Go Flip 3 features a TN TFT display, Qualcomm MSM8909 Snapdragon 210 (28 nm) processor, and Li-Ion 1350 mAh, removable battery. Available. Released 2019, September 19.

TN TFTQualcomm MSM8909 Snapdragon 210 (28 nm)Li-Ion 1350 mAh, removable4GB 512MB RAM
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Highlights

The alcatel Go Flip 3 features Launched . released 2019, september 19, Qualcomm MSM8909 Snapdragon 210 (28 nm) processor, TN TFT 2.8 inches, 24.3 cm2 (~43.6% screen-to-body ratio) display, 720p@30fps camera setup, Li-Ion 1350 mAh, removable battery, and 118 g (4.16 oz) weight.

Display
TN TFT
Size
2.8 inches, 24.3 cm2 (~43.6% screen-to-body ratio)
Processor
Qualcomm MSM8909 Snapdragon 210 (28 nm)
RAM/Storage
4GB 512MB RAM
Battery
Li-Ion 1350 mAh, removable
Camera
720p@30fps
Dimensions
104.9 x 53.1 x 20.1 mm (4.13 x 2.09 x 0.79 in)
Weight
118 g (4.16 oz)
Released
Available. Released 2019, September 19
OS
KaiOS 2.5

Full Specifications

Launch

Announced
2019, September 19
Status
Available. Released 2019, September 19

Body

Dimensions
104.9 x 53.1 x 20.1 mm (4.13 x 2.09 x 0.79 in)
Weight
118 g (4.16 oz)
SIM
Nano-SIM

Display

Type
TN TFT
Size
2.8 inches, 24.3 cm2 (~43.6% screen-to-body ratio)
Resolution
240 x 320 pixels, 4:3 ratio (~143 ppi density)
Protection
..

Chipset

OS
KaiOS 2.5
Chipset
Qualcomm MSM8909 Snapdragon 210 (28 nm)
CPU
Quad-core 1.1 GHz Cortex-A7
GPU
Adreno 304

Storage

Internal
4GB 512MB RAM
Card slot
microSDHC (dedicated slot)

Camera

Single
2 MP
Features
..
Video
720p@30fps

Selfie

..
..
Features
..
Video
..

Sound

Loudspeaker
Yes
3.5mm jack
Yes

Battery

Type
Li-Ion 1350 mAh, removable
Charging
..
Wireless
..

Systems

Technology
GSM / CDMA / HSPA / LTE
2G bands
GSM 850 / 900 / 1800 / 1900
3G bands
HSDPA 850 / 1700(AWS) / 1900
4G bands
2, 4, 5, 12, 25, 26, 41, 66, 71
5G bands
..
Speed
HSPA, LTE
Sensors
..
Colors
Prime Black
Models
..
WLAN
Wi-Fi 802.11 b/g/n, hotspot
Bluetooth
4.2, A2DP
GPS
No

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